A novel heatsink based on a multilayer stack of thin metal plates with staggered honeycomb cell microchannels was investigated in this paper. A series of working-parametric tests such as different heat sink pipe diameter and pumping power were conducted for the microchannel cooling system to determine the heat transfer performance under small flow rate conditions. For the double fluid flow inlets and outlets heatsink design, experimental results showed that more uniform substrate temperature distribution was obtained than the single inlet and outlet ones. It showed that the heatsink design provided a good choice for electronic chips cooling applications.
