In order to obtain both high electromigration （EM） reliability and free-dimensional control in high-frequency surface acoustic wave （SAW） devices, 4-layered Ti/Al-Mo/Ti/Al-Mo electrode films were investigated on 128° Y-X LiNbO3 substrates by sputtering deposition. The resuits indicated that the 4-layered films had an improved EM reliability compared to conventional Al-0.5wt.%Cu films. Their lifetime is approximately three times longer than that of the Al-0.5wt.%Cu films tested at a current density of 5 x 107 A/cm^2 and a temperature of 200℃. Moreover, the 4-layered films were easily etched in reactive ion etching and fine-dimensional control was realized during the pattern replication for high-frequency SAW devices. For the 4-layered films, an optimum Mo quantity and sputtering parameters were very significant for high EM reliability.
Polycrystalline ZnO films are prepared using radio frequency magnetron sputtering on glass substrates which are sputter-etched for different time. Both the size of ZnO grains and the root-mean-square (RMS) roughness decrease, as the sputter-etching time of the substrate increases. More Zn atoms are bound to O atoms in the films, and the defect concentration is decreased with increasing sputter-etching time of substrate. Meanwhile, the crystallinity and c-axis orientation are improved at longer sputter-etching time of the substrate. The Raman peaks at 99 cm-1, 438 cm-1 and 589 cm-1 are identified as E2(low), E2(high) and E1(LO) modes, respectively, and the position of E1(LO) peak blue shifts at longer sputter-etching time. The transmittances of the films, which are deposited on the substrate and etched for 10 min and 20 min, are higher in the visible region than that of the films deposited under longer sputter-etching time of 30 min. The bandgap increases from 3.23 eV to 3.27 eV with the increase of the sputter-etching time of substrate.
